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Книги
Статті (38)
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1

Designing and Modeling for Power Integrity

Swaminathan, M., Daehyun Chung, Grivet-Talocia, S., Bharath, K., Laddha, V., Jianyong Xie

Журнал:

IEEE Transactions on Electromagnetic Compatibility

Рік:

2010

Мова:

english

Файл:

PDF, 2.58 MB

english, 2010

2

Location of the ventral margin of the paracaval portion of the caudate lobe of the human liver with special reference to the configuration of hepatic portal vein branches

Daehyun Kwon, Gen Murakami, Fumitake Hata, Hee Jung Wang, Min Suk Chung, Koichi Hirata

Журнал:

Clinical Anatomy

Рік:

2002

Мова:

english

Файл:

PDF, 2.15 MB

english, 2002

3

Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects

Bandyopadhyay, T., Ki Jin Han, Daehyun Chung, Chatterjee, R., Swaminathan, M., Tummala, R.

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2011

Мова:

english

Файл:

PDF, 1.48 MB

english, 2011

4

[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - High frequency electrical circuit model of chip-to-chip vertical via interconnection for 3-D chip stacking package

Chunghyun Ryu,, Daehyun Chung,, Junho Lee,, Kwangyong Lee,, Taesung Oh,, Joungho Kim,

Рік:

2005

Мова:

english

Файл:

PDF, 2.13 MB

english, 2005

5

A real time process management system using RFID data mining

Kwon, Kyunglag, Kang, Daehyun, Yoon, Yeochang, Sohn, Jong-Soo, Chung, In-Jeong

Журнал:

Computers in Industry

Рік:

2014

Мова:

english

Файл:

PDF, 2.88 MB

english, 2014

6

[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications

Jinwoo Choi,, Dong Gun Kam,, Daehyun Chung,, Srinivasan, K., Govind, V., Joungho Kim,, Swaminathan, M.

Рік:

2005

Мова:

english

Файл:

PDF, 2.68 MB

english, 2005

7

[IEEE Electrical Performance of Electronic Packaging - Princeton, NJ, USA (2003.10.27-2003.10.29)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Open load backward matching (OLBM) technique for low ISI differential H-tree clock and data transmission

Daehyun Chung,, Seungyong Baek,, Joungho Kim,

Рік:

2003

Мова:

english

Файл:

PDF, 213 KB

english, 2003

8

[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - Implementation of low jitter clock distribution using chip-package hybrid interconnection

Chunghyun Ryu,, Daehyun Chung,, Kicheol Bae,, Jiheon Yu,, Joungho Kim,

Рік:

2004

Мова:

english

Файл:

PDF, 272 KB

english, 2004

9

[IEEE Electrical Performance of Electronic Packaging - Princeton, NJ, USA (2003.10.27-2003.10.29)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Compensation of ESD and input capacitance effect by using package bondwire inductance for over Gbps differential SerDes devices

Seungyoung Ahn,, Jongbae Park,, Daehyun Chung,, Joungho Kim,

Рік:

2003

Мова:

english

Файл:

PDF, 217 KB

english, 2003

10

[IEEE 2012 IEEE International Symposium on Circuits and Systems - ISCAS 2012 - Seoul, Korea (South) (2012.05.20-2012.05.23)] 2012 IEEE International Symposium on Circuits and Systems - Improved hard-decision decoding LDPC Codec IP design

Kim, Daehyun, Chung, Biwoong, Kim, Roy E.

Рік:

2012

Мова:

english

Файл:

PDF, 682 KB

english, 2012

11

Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications

Choi, Jinwoo, Kam, Dong Gun, Chung, Daehyun, Srinivasan, Krishna, Govind, Vinu, Kim, Joungho, Swaminathan, Madhavan

Журнал:

IEEE Transactions on Advanced Packaging

Рік:

2007

Мова:

english

Файл:

PDF, 1.76 MB

english, 2007

12

Feasibility study of the neutron dose for real-time image-guided proton therapy: A Monte Carlo study

Kim, Jin Sung, Shin, Jung Suk, Kim, Daehyun, Shin, Eunhyuk, Chung, Kwangzoo, Cho, Sungkoo, Ahn, Sung Hwan, Ju, Sanggyu, Chung, Yoonsun, Jung, Sang Hoon, Han, Youngyih

Журнал:

Journal of the Korean Physical Society

Рік:

2015

Мова:

english

Файл:

PDF, 685 KB

english, 2015

13

Organic lightâemitting diode display pixel circuit employing doubleâgate lowâtemperature polyâSi thinâfilm transistor and metalâoxide thinâfilm transistors

Lee, JoonHo, Kim, DaeHyun, Yang, JooWon, Moon, KookChul, Lee, SooâYeon, Jeon, JaeHong, Kim, YongSang, Choi, SeungChan, Chung, UiJin, Park, KwonShik, Park, KeeChan

Журнал:

Journal of the Society for Information Display

Рік:

2020

Файл:

PDF, 24.55 MB

2020

14

An isotonic estimator of the baseline hazard function in Cox's regression model under order restriction

Daehyun Chung, Myron N. Chang

Журнал:

Statistics & Probability Letters

Рік:

1994

Мова:

english

Файл:

PDF, 376 KB

english, 1994

15

Bis(indole) alkaloids as sortase A inhibitors from the sponge Spongosorites sp.

Ki-Bong Oh, Woongchon Mar, Sanghee Kim, Ji-Yun Kim, Mi-Na Oh, Jae-Gyu Kim, Daehyun Shin, Chung J. Sim, Jongheon Shin

Журнал:

Bioorganic & Medicinal Chemistry Letters

Рік:

2005

Мова:

english

Файл:

PDF, 150 KB

english, 2005

16

Ventral margin of the paracaval portion of human caudate lobe

Daehyun Kwon, Gen Murakami, Hee Jung Wang, Min Suk Chung, Fumitake Hata, Koichi Hirata

Журнал:

Journal of Hepato-Biliary-Pancreatic Sciences

Рік:

2001

Мова:

english

Файл:

PDF, 854 KB

english, 2001

17

Isotonic Window Estimators of the Baseline Hazard Function in Cox's Regression Model Under Order Restriction

Myron N. Chang, Daehyun Chung

Журнал:

Scandinavian Journal of Statistics

Рік:

1998

Мова:

english

Файл:

PDF, 196 KB

english, 1998

18

Chip-package hybrid clock distribution network and DLL for low jitter clock delivery

Daehyun Chung, Chunghyun Ryu, Hyungsoo Kim, Choonheung Lee, Jinhan Kim, Kicheol Bae, Jiheon Yu, Hoijun Yoo, Joungho Kim

Журнал:

IEEE Journal of Solid-State Circuits

Рік:

2006

Мова:

english

Файл:

PDF, 1.95 MB

english, 2006

19

Prospective comparison of magnetic resonance cholangiopancreatography with endoscopic retrograde cholangiopancreatography in the evaluation of patients with suspected biliary tract disease

WonYoung Tak, SungSu Ha, YoungDoo Lee, SungWoo Jun, DaeHyun Kim, HyunSu Kim, ChoognGu Kweon, YongHwan Choi, YoungOh Kweon, SungKook Kim, JoonMo Chung

Журнал:

Gastroenterology

Рік:

2000

Мова:

english

Файл:

PDF, 193 KB

english, 2000

20

Risk factors for post-ERCP pancreatitis: A prospective study

WonYoung Tak, DaeHyun Kim, Hyunsu Kim, ChoonGu Kweon, YoungOh Kweon, SungKook Kim, YongHwan Choi, JoonMo Chung

Журнал:

Gastroenterology

Рік:

2000

Мова:

english

Файл:

PDF, 193 KB

english, 2000

21

[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Electrical modeling of Through Silicon and Package Vias

Bandyopadhyay, Tapobrata, Chatterjee, Ritwik, Chung, Daehyun, Swaminathan, Madhavan, Tummala, Rao

Рік:

2009

Мова:

english

Файл:

PDF, 952 KB

english, 2009

22

[IEEE ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005. - San Francisco, CA, USA (Feb. 6-10, 2005)] ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005. - A chip-package hybrid DLL loop and clock distribution network for low-jitter clock delivery

Daehyun Chung,, Chunghyun Ryu,, Hyungsoo Kim,, Choonheung Lee,, Jaedong Kim,, Jinyoung Kim,, Kicheol Bae,, Jiheon Yu,, Seungjae Lee,, Hoijun Yoo,, Joungho Kim,

Рік:

2005

Мова:

english

Файл:

PDF, 1.64 MB

english, 2005

23

A Three-Dimensional Stacked-Chip Star-Wiring Interconnection for a Digital Noise-Free and Low-Jitter I/O Clock Distribution Network

Ryu, Chunghyun, Chung, Daehyun, Lee, Choonheung, Kim, Jinhan, Bae, Kicheol, Yu, Jiheon, Lee, Seungjae, Kim, Joungho

Журнал:

IEEE Microwave and Wireless Components Letters

Рік:

2006

Мова:

english

Файл:

PDF, 1.15 MB

english, 2006

24

[IEEE 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2009.10.19-2009.10.21)] 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems - Achieving near zero SSN power delivery networks by eliminating power planes and using constant current power transmission lines

Huh, Suzanne, Chung, Daehyun, Swaminathan, Madhavan

Рік:

2009

Мова:

english

Файл:

PDF, 330 KB

english, 2009

25

[IEEE 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Shatin, Hong Kong, China (2009.12.2-2009.12.4)] 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - Filter integration in ultra thin organic substrate via 3D stitched capacitor

Min, Sunghwan, Hwang, Seunghyun, Chung, Daehyun, Swaminathan, Madhavan, Sridharan, Vivek, Chan, Hunter, Fuhan Liu,, Sundaram, Venky, Tummala, Rao R.

Рік:

2009

Мова:

english

Файл:

PDF, 808 KB

english, 2009

26

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Overview of power/ground effects on data eye and clock jitter: from board resonance to silicon substrate coupling

Daehyun Chung,, Hyungsoo Kim,, Joungho Kim,

Рік:

2003

Мова:

english

Файл:

PDF, 219 KB

english, 2003

27

[IEEE 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2009.10.19-2009.10.21)] 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems - Electrical modeling of annular and co-axial TSVs considering MOS capacitance effects

Bandyopadhyay, Tapobrata, Chatterjee, Ritwik, Chung, Daehyun, Swaminathan, Madhavan, Tummala, Rao

Рік:

2009

Мова:

english

Файл:

PDF, 381 KB

english, 2009

28

[IEEE 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2009.10.19-2009.10.21)] 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems - Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration

Xie, Jianyong, Chung, Daehyun, Swaminathan, Madhavan, Mcallister, Michael, Deutsch, Alina, Jiang, Lijun, Rubin, Barry J

Рік:

2009

Мова:

english

Файл:

PDF, 752 KB

english, 2009

29

[IEEE 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Shatin, Hong Kong, China (2009.12.2-2009.12.4)] 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - Near zero SSN power delivery networks using Constant Voltage Power Transmission Lines

Huh, Suzanne, Chung, Daehyun, Swaminathan, Madhavan

Рік:

2009

Мова:

english

Файл:

PDF, 3.00 MB

english, 2009

30

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Simultaneous switching noise model by distributed power port and ground current capture

Hwang, Seunghyun, Chung, Daehyun, Satagopan, Venkat, Sudhakaran, Sunil, Lin, Daniel, Moghadam, Fathi

Рік:

2013

Мова:

english

Файл:

PDF, 1.11 MB

english, 2013

31

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - A Novel Synthesis Method for Designing Electromagnetic Band Gap (EBG) Structures in Packaged Mixed Signal Systems

Tae Hong Kim,, Daehyun Chung,, Engin, E., Wansuk Yun,, Toyota, Y., Swaminathan, M.

Рік:

2006

Мова:

english

Файл:

PDF, 1.26 MB

english, 2006

32

[IEEE 2006 IEEE Electrical Performane of Electronic Packaging - Scottsdale, AZ, USA (2006.10.23-2006.10.25)] 2006 IEEE Electrical Performane of Electronic Packaging - Effect of EBG Structures for Reducing Noise in Multi-Layer PCBs for Digital Systems

Chung, Daehyun, Kim, Tae, Ryu, Chunghyun, Engin, Ege, Swaminathan, Madhavan, Kim, Joungho

Рік:

2006

Мова:

english

Файл:

PDF, 3.74 MB

english, 2006

33

Liquid-Based Cytology of Villoglandular Adenocarcinoma of the Cervix: A Report of 3 Cases

Choi, Younghwa, Kim, Haeryoung, Choi, Haiyoung, Hwang, Daehyun, Choe, Gheeyoung, Chung, Jin-Haeng, Park, So Yeon, Lee, Hye Seung, Paik, Jin Ho, Park, Hyo Jin

Журнал:

The Korean Journal of Pathology

Рік:

2012

Мова:

english

Файл:

PDF, 2.20 MB

english, 2012

34

[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Chip-package co-design of power distribution network for system-in-package applications

Gawon Kim,, Dong Gun Kam,, Daehyun Chung,, Joungho Kim,

Рік:

2004

Мова:

english

Файл:

PDF, 230 KB

english, 2004

35

[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Electrical-thermal co-analysis for power delivery networks in 3D system integration

Xie, Jianyong, Chung, Daehyun, Swaminathan, Madhavan, Mcallister, Michael, Deutsch, Alina, Jiang, Lijun, Rubin, Barry J

Рік:

2009

Мова:

english

Файл:

PDF, 1.16 MB

english, 2009

36

Isotonic Window Estimators of the Baseline Hazard Function in Cox's Regression Model under Order Restriction

Myron N. Chang and Daehyun Chung

Журнал:

Scandinavian Journal of Statistics

Рік:

1998

Мова:

english

Файл:

PDF, 970 KB

english, 1998

37

Antimicrobial Activity and Cytotoxicity of Bis(indole) Alkaloids from the Sponge Spongosorites sp.

Oh, Ki-Bong, Mar, Woongchon, Kim, Sanghee, Kim, Ji-Yun, Lee, Tae-Hoon, Kim, Jae-Gyu, Shin, Daehyun, Sim, Chung J., Shin, Jongheon

Журнал:

Biological & Pharmaceutical Bulletin

Рік:

2006

Мова:

english

Файл:

PDF, 76 KB

english, 2006

38

[IEEE 2020 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR) - Seattle, WA, USA (2020.6.13-2020.6.19)] 2020 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR) - AdaCoF: Adaptive Collaboration of Flows for Video Frame Interpolation

Lee, Hyeongmin, Kim, Taeoh, Chung, Tae-young, Pak, Daehyun, Ban, Yuseok, Lee, Sangyoun

Рік:

2020

Файл:

PDF, 672 KB

2020